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datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/19 tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .14.001 earth leakage current detector ic series earth leakage current detector ic bd95850f-lb description this is the product guarantees long time support in industrial market. the bd95850f-lb is the monolithic ic integrates earth leakage detection, signal amplification, and overvoltage detection . especially, its suitable for high-sensitivity and high -speed operation use, and, since the operating temperature range is wide, it can be used for various applications. features long time support product for industrial applications small temperature fluctuation and high input sensitivity wide operating temperature range detection mode selectable (1 count method /1.5 count method) applications earth leakage circuit breaker earth leakage circuit relay industrial equipment key specifications operating supply voltage range: 7v to 13v operating temperat ure range: -30c to +95c supply current: 830 a(typ) trip voltage(leakage detection dc voltage): 7.5mv output current ability : -100 a(min) package w(typ) x d(typ) x h(max) sop14 8.70mm x 6.20mm x 1.71mm typical application circuit example zct:zero-phase current transformer trip coil power supply leakage detection overvoltage detection reset scr driver iref vref ilki trc1 trc2 psel offc scrt ibli ttdc vcc psav vs 1234567 14 13 12 11 10 9 8 scr vcc vcc c os c offc c ttdc c rc1 c rc2 vcc r vs c vs v z downloaded from: http:///
datasheet datasheet 2/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 sop14 (top view) 1 2 3 4 5 6 7 14 13 12 11 10 9 8 pin configurations block diagrams pin descriptions pin no. symbol function pin no. symbol function 1 gnd ground 8 scrt output for driving thyristor 2 iref connect a resistor to set constant current of the internal circuits 9 offc connect a capacito r to set reset time 3 vref reference voltage output 10 ttdc connect a capacitor to set over-voltage detection time 4 ilki input of leakage detection signal 11 ibli input of over-voltage detection signal 5 trc1 connect a capacitor for charge current of negative detection 12 psav enable pin for overvoltage detection function 6 trc2 connect a capacitor for charge current of positive detection 13 vcc internal power supply 7 psel logic function switching pin for leakage detection 14 vs power supply absolute maximum ratings (t a =25c) parameter symbol rating unit condition supply current i s 4 ma supply voltage (note 1) v s 18 v input voltage v in -1.5 to +1.5 v ac ross ilki and vref input current i in -5 to +5 ma across ilki and vref input current of vref i vref 10 ma across vref and gnd input voltage v xxxx 8 v iref/ref/in/trc1/trc2/ psel/scrt/offc/psav/ ttdc/vcc/ibli input voltage of overvoltage detection v ibli -0.3 to +5.0 v across ibli and gnd input current of overvoltage detection i ibli 4 ma across ibli and gnd power dissipation p d 0.56 (note 2) w operating temperature t opr -30 to +95 c storage temperature t stg -55 to +150 c (note 1) supply voltage is limited by inter nal clamping circuit . please refer to maximum current voltage of the electrical ch aracteristic item. (note 2) mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 4.5mw per 1c above 25c. caution: operating the ic over the absolute maximum ratings may damag e the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit pr otection measures, such as ad ding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol rating unit supply voltage v sopr 7 to 13 v power supply leakage detection overvoltage detection reset scr drive iref vref ilki trc1 trc2 psel offc scrt ibli ttdc vcc psav vs 1234567 14 13 12 11 10 9 8 downloaded from: http:///
datasheet datasheet 3/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 electrical characteristic (unless otherwise specified vs=9v,gnd=0v, t a =25c) item symbol limits unit condition min typ max supply current : during standby i s0 - 830 940 a psav=vcc supply current : during leakage detection i s1 - 840 950 a psav=vcc supply current : during overvoltage detection i s2 - 840 950 a psav=vcc supply current : during scrt pin is "h" i s3 - - 870 a psav=vcc supply current : during standby i s0' - 750 860 a psav=gnd supply current : during leakage detection i s1' - 760 870 a psav=gnd supply current : during scrt pin is "h" i s3' - - 870 a psav=gnd i s0 ambient temperature dependence - - -0.07 - %/ c t a =-30c to +85c voltage at maximum current v sm 13.2 14.8 16.4 v i s =3ma leakage detection dc input voltage v t - 7.5 - mv ilki pin input bias current i ih - 1 15 na v ilki =vref vref pin output voltage v vref - 2.4 - v ilki-vref input clamping voltage v incl - 0.8 - v i ilki =3ma vref-gnd clamping voltage v vrefcl - 5.5 - v i rcl =5ma trc1 pin "h" output current precision e ioh -20 - +20 % v o =0v i oh =-10a trc1 pin threshold voltage v th - 2.4 - v tw1 pulse width precision e tw1 -15 - +15 % c=0.01f t w1 =2.3ms tw1 ambient temperature dependence - - -0.08 - %/ c t a =-30c to +85c trc2 pin "h" output current precision e ioh -20 - +20 % v o =0v i oh =-10a trc2 pin threshold voltage v th - 2.4 - v tw2 pulse width precision e tw2 -15 - +15 % c=0.0047f t w1 =1.1ms tw2 ambient temperature dependence - - -0.08 - %/ c t a =-30c to +85c v t ambient temperature dependence - - -4 - % t a =+25c to +85c - -2 - % t a =+25c to -30c overvoltage detection voltage v ibli 2.3 2.4 2.5 v v ibli supply voltage dependence - - 0.1 - %/v v ibli ambient temperature dependence - - 0.06 - %/c t a =-30c to +85c ibli pin input bias current i ibli - 50 300 na v in =vref ibli-gnd clamping voltage v iblicl - 6.1 - v i in =1ma ttdc pin "h" output current precision e ioh -20 - +20 % v o =0v i oh =-8a ttdc pin threshold voltage v th - 2.4 - v delay time pulse width precision e tw4 -30 - +30 % c=1.0f t w4 =300ms offc pin "h" output current precision e ioh -20 - +20 % v o =0v i oh =-10a offc pin threshold voltage v th - 2.4 - v reset timer pulse width precision e tw3 -30 - +30 % c=0.33f t w3 =55ms scrt pin "l" output voltage v ol3 - 0.02 0.2 v i cl =200a scrt pin "h" output current i ohc - -300 -200 a t a =-30c,vo=0.8v i ohn - -260 -100 a t a =+25c,vo=0.8v i ohh - -210 -70 a t a =+85c,vo=0.8v i oh hold supply voltage v soff - 3.7 - v downloaded from: http:///
datasheet datasheet 4/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 function explanation 1.switching of leakage detection mode the input logic to become output scrt=high psel pin voltage vcc negative input positive input (1 count method mode) gnd negative input positive input negative input (1.5 count method mode) 2.on/off switching of overvoltage detection function state of the overvoltage detection function psav pin voltage vcc on gnd off 3.reset function please connect a capacitor to offc pin (pin.9) to set time in follows for making an ic initial state after a certain period o f time. ? when a leakage detection input signal does not continue ? when an overvoltage detection signal does not continue ? after leakage detection or overvoltage detec tion, scrt output voltage becomes high 4.overvoltage detection wait time after first overvoltage detection, scrt output voltage becomes h when o vervoltage is detected after a certain period of time. please set the wait time with a capacitor connecting to ttdc pin (pin.10). 5.time delay function as shown below, by applying overvoltage detection function, the leakage detection function can be provided with a time delay function. however, the overvoltage detection function can not be used. in figure 1; it is set by a diode betw een pin.6 and pin.10, gnd connection of pin.11. in figure 2; it is set by pnp transistor betwe en pin.6 and pin.10, gnd connection of pin.11. in the case of figure 2, the delay ti me becomes approximately 60% of figure 1. figure 1. setting of time delay function 1 figure 2. setting of time delay function 2 6.iref terminal a resistance connecting to this terminal becomes the standar d constant current source of this ic. cause this resistance determines the characteristic of each circuit, it is recomme nded that a high precision resistance (+-1%) be used. vcc trip coil vcc vcc power supply leakage detection overvoltage detection reset scr driver iref vref ilki trc1 trc2 psel offc scrt ibli ttdc vcc psav vs 1234567 14 13 12 11 10 9 8 vcc trip coil vcc vcc power supply leakage detection overvoltage detection reset scr driver iref vref ilki trc1 trc2 psel offc scrt ibli ttdc vcc psav vs 1234567 14 13 12 11 10 9 8 downloaded from: http:///
datasheet datasheet 5/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 timing chart 1. earth leakage detection 1-1. 1 count method 1-2. 1.5 count method downloaded from: http:///
datasheet datasheet 6/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 timing chart - continued 2.overvoltage detection 3.a time delay function for leakage detection after the first leakage detection, scrt pin becomes h after a certain period of time. offc scrt tw3 tw4 2.4v ttdc ibli 2.4v2.4v downloaded from: http:///
datasheet datasheet 7/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 test circuit (rbias=120k ? ) rbias rbias downloaded from: http:///
datasheet datasheet 8/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 y [a] y [] y [a] y [] w [] a [] 95 typical performance curves (reference data) [] y [a] figure 3. supply current - supply voltage during standby figure 4. supply current - supply voltage during standby figure 1. derating curve figure 2. supply voltage - supply current 25 c 105c -40 c psav=gnd psav=vcc 25 c 125 c -40 c 25 c 125 c -40 c downloaded from: http:///
datasheet datasheet 9/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 [] y [] [] y [] i [] y [a] [] i [a] typical performance curves (reference data) - continued figure 5. vcc pin voltage - supply voltage figure 6. vref pin voltage - supply voltage figure 7. iref pin voltage - supply voltage figure 8. vref pin clamping voltage - input current 25 c 125 c -40 c 25 c 125 c -40 c 25 c 105 c -40 c 25 c 125 c -40 c downloaded from: http:///
datasheet datasheet 10/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 i [] a [] typical performance curves (reference data) - continued y [] [a] a [] [] figure 9. trip voltage C ambient temperature figure 10. overvoltage detection threshhold voltage - ambient temperature figure 11. scrt pin source current - supply voltage figure 12. overvoltage detection threshhold voltage - supply voltage vt+ vt- y [] i [] 25 125 -40 downloaded from: http:///
datasheet datasheet 11/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 [a] y [] typical performance curves (reference data) - continued y [] [a] y [] [a] figure 13. offc pin source current - supply voltage figure 14. ttdc pin source current - supply voltage figure 15. trc1/2 pin source current - supply voltage 25 c 125c -40 c 25c 125 c -40c 25c 125c -40c downloaded from: http:///
datasheet datasheet 12/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 25 50 75 100 125 150 ambient temperature [ ] power dissipation [w] 95 power dissipation power dissipation(total loss) indicates the power that can be consumed by ic at t a =25c (normal temperature).ic is heated when it consumed power, and the temperature of ic chip becomes higher than ambi ent temperature. the temperature that can be accepted by ic chip depends on circ uit configuration, manufactu ring process, and consumable power is limited. power dissipation is determined by the temperature allowed in ic chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). the maximum junction temperature is typically equal to the maximum value in the storage temperature range. heat generated by consumed power of ic radiates from the mold resin or lead frame of the package. the parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol ja c/w. the temperature of ic inside the package can be estimated by this thermal resistance. figure 16(a) shows the model of thermal resistance of the package. thermal resistance ja , ambient temperature t a , junction temperature t jmax , and power dissipation p d can be calculated by the equation below ja = (t jmax - t a ) / p d c /w ????? ( ) derating curve in figure 16(b) indicates power that can be cons umed by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambient temperature. this gradient is determined by thermal resistance ja . thermal resistance ja depends on chip size, power consumpti on, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 17(a) show a derating curve for an example of bd95850f-lb . derating curve slope unit bd95850f-lb 4.5 mw/c when using the unit above t a =25c, subtract the value above per degree power dissipation is a value when glass epoxy board 70mm70mm1.6mm (cooper foil area below 3%) is mounted. figure 17. derating curve (a) bd95850f-lb (a) thermal resistance figure 16. thermal resistance and derating curve ja =(t jmax -t a )/p c /w ?? ta [ ] ? ? tj [ ] M [] ambient temperature t a [c ] chip surface temperature t j [c ] 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (m ax ) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (m ax ) ?? p d(max) ja2 < ja1 ja2 ja2 ja1 ja1 t a [ c ] t jmax t jmax lsi M ambient temperature t a [c ] power dissi p ation of lsi (b) derating curve downloaded from: http:///
datasheet datasheet 13/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 pin.1 [gnd] pin.5 [trc1] pin.2 [iref] pin.6 [trc2] pin.3 [ref] pin.7 [psel] pin.4 [in] pin.8 [scrt] vcc vcc vcc vcc pin.4 322k ? 500 ? 350 ? 150 ? vcc pin.3 vcc 350 ? vcc 150 ? vcc vcc vcc vcc vcc vcc vcc 50k ? vcc i/o equivalence circuit downloaded from: http:///
datasheet datasheet 14/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 i/o equivalence circuit - continued pin.9 [offc] pin.12 [psav] pin.10 [ttdc] pin.13 [vcc] pin.11 [ibli] pin.14 [vs] cl bg vcc vcc vcc vcc vcc vcc internal circuit pin.14 downloaded from: http:///
datasheet datasheet 15/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of t he pd stated in this s pecification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal po wering sequence and delays, especially if the ic has more than one power supply. therefore, give specia l consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application boar d, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capa citors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup duri ng the inspection process. to prevent damage from static discharge, ground the ic durin g assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when m ounting the ic on the pcb. inco rrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
datasheet datasheet 16/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 operational notes C continued 11. unused input terminals input terminals of an ic are often conn ected to the gate of a mo s transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signif icant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specif ied, unused input terminals should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adj acent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions t hat cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 18. example of monolithic ic structure downloaded from: http:///
datasheet datasheet 17/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 ordering information b d 9 5 8 5 0 f - l b e 2 part numbe r packagef: sop14 product class lb for industrial applications packaging and forming specification e2: embossed tape and reel marking diagram sop14 (top view) bd95850f lot numbe r 1pin mark downloaded from: http:///
datasheet datasheet 18/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 physical dimension, tape and reel information package name sop14 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop14 drawing no. : ex113-5001 (max 9.05 (include.burr)) downloaded from: http:///
datasheet datasheet 19/19 bd95850f-lb tsz02201- 0rcr1gz00130-1-2 ? 2014 rohm co., ltd. all rights reserved. 13.jun.2014 rev.001 www.rohm.com tsz22111 .15.001 revision history date revision changes 13.jun.2014 001 new release downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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